"Enhancing the microstructure and tensile creep resistance of ..."

Ahmed E. Hammad, A. A. Ibrahiem (2017)

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DOI: 10.1016/J.MICROREL.2017.07.034

access: closed

type: Journal Article

metadata version: 2024-09-17

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Ahmed E. Hammad, A. A. Ibrahiem:
Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles. Microelectron. Reliab. 75: 187-194 (2017)

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