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"Development of a thermal resistance model for chip-on-board packaging of ..."

Minseok Ha, Samuel Graham (2012)

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DOI: 10.1016/J.MICROREL.2012.02.005

access: closed

type: Journal Article

metadata version: 2020-02-22

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Minseok Ha, Samuel Graham:
Development of a thermal resistance model for chip-on-board packaging of high power LED arrays. Microelectron. Reliab. 52(5): 836-844 (2012)

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