"Silicon based system in package: Improvement of passive integration ..."

Christian Gautier et al. (2008)

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DOI: 10.1016/J.MICROREL.2008.07.033

access: closed

type: Journal Article

metadata version: 2020-02-22

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Christian Gautier, Sophie Ledain, Sébastien Jacqueline, Matthieu Nongaillard, Vincent Georgel, Karine Danilo:
Silicon based system in package: Improvement of passive integration process to avoid TBMS failure. Microelectron. Reliab. 48(8-9): 1258-1262 (2008)

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