"Copper Wire Bonding, Preeti S., Chauhan, Anupam Choubey, ZhaoWei Zhong, ..."

Chong Leong Gan et al. (2014)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2013.10.024

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/GanFCH14
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/GanFCH14
Chong Leong Gan, Classe Francis, Bak Lee Chan, Uda Hashim:
Copper Wire Bonding, Preeti S., Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G. Pecht, Springer (2014). XXVI, pp 235, ISBN: 978-1-4614-5760-2 (Print), 978-1-4614-5761-9 (Online). Microelectron. Reliab. 54(2): 490 (2014)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.