"The effect of die attach voiding on the thermal resistance of chip level ..."

Amy S. Fleischer, Li-Hsin Chang, Barry C. Johnson (2006)

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DOI: 10.1016/J.MICROREL.2005.01.019

access: closed

type: Journal Article

metadata version: 2023-02-09

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Amy S. Fleischer, Li-Hsin Chang, Barry C. Johnson:
The effect of die attach voiding on the thermal resistance of chip level packages. Microelectron. Reliab. 46(5-6): 794-804 (2006)

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