"Torsion test applied for reballing and solder paste volume evaluation."

W. C. Maia Filho et al. (2007)

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DOI: 10.1016/J.MICROREL.2007.07.028

access: closed

type: Journal Article

metadata version: 2020-02-22

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W. C. Maia Filho, M. Brizoux, Hélène Frémont, Yves Danto:
Torsion test applied for reballing and solder paste volume evaluation. Microelectron. Reliab. 47(9-11): 1663-1667 (2007)

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