"Defect inspection of solder bumps using the scanning acoustic microscopy ..."

Mengying Fan et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.08.010

access: closed

type: Journal Article

metadata version: 2020-02-22

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Mengying Fan, Li Wei, Zhenzhi He, Wei Wei, Xiangning Lu:
Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm. Microelectron. Reliab. 65: 192-197 (2016)

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