"Design and optimization of thermo-mechanical reliability in wafer level ..."

X. J. Fan, B. Varia, Q. Han (2010)

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DOI: 10.1016/J.MICROREL.2009.11.010

access: closed

type: Journal Article

metadata version: 2020-02-22

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X. J. Fan, B. Varia, Q. Han:
Design and optimization of thermo-mechanical reliability in wafer level packaging. Microelectron. Reliab. 50(4): 536-546 (2010)

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