"Mechanical and electrical properties of ultra-thin chips and flexible ..."

D. A. van den Ende et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.07.125

access: closed

type: Journal Article

metadata version: 2020-10-27

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D. A. van den Ende, H. J. van de Wiel, Roel H. L. Kusters, Ashok Sridhar, J. F. M. Schram, Maarten Cauwe, Jeroen van den Brand:
Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending. Microelectron. Reliab. 54(12): 2860-2870 (2014)

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