"Computational modeling of creep-based fatigue as a means of selecting ..."

Jürgen Eckermann et al. (2014)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2014.02.017

access: closed

type: Journal Article

metadata version: 2020-10-26

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/EckermannMDLBSJS14
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/EckermannMDLBSJS14
Jürgen Eckermann, Shahid Mehmood, Helen Davies, Nick P. Lavery, Stephen G. R. Brown, Johann Sienz, A. Jones, P. Sommerfeld:
Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys. Microelectron. Reliab. 54(6-7): 1235-1242 (2014)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.