"Analytical solution on interfacial reliability of 3-D through-silicon-via ..."

Yingtao Ding et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.02.030

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yingtao Ding, Yangyang Yan, Qianwen Chen, Shiwei Wang, Rui Su, Hua Dang:
Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner. Microelectron. Reliab. 54(6-7): 1384-1391 (2014)

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