"Study on the methods to measure the junction-to-case thermal resistance of ..."

Erping Deng et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.05.032

access: closed

type: Journal Article

metadata version: 2020-02-22

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Erping Deng, Zhibin Zhao, Peng Zhang, Jinyuan Li, Yongzhang Huang:
Study on the methods to measure the junction-to-case thermal resistance of IGBT modules and press pack IGBTs. Microelectron. Reliab. 79: 248-256 (2017)

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