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"Failure mechanism of FBGA solder joints in memory module subjected to ..."

Yusuf Cinar et al. (2012)

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DOI: 10.1016/J.MICROREL.2011.11.015

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/CinarJJKJCJ12
Yusuf Cinar, Jinwoo Jang, Gunhee Jang, Seonsik Kim, Jaeseok Jang, Jinkyu Chang, Yonghyun Jun:
Failure mechanism of FBGA solder joints in memory module subjected to harmonic excitation. Microelectron. Reliab. 52(4): 735-743 (2012)

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