"A study of large area die bonding materials and their corresponding ..."

Te-yuan Chung et al. (2012)

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DOI: 10.1016/J.MICROREL.2011.03.029

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/ChungJCLHWS12
Te-yuan Chung, Jian-Hong Jhang, Jing-Sian Chen, Yi-Chien Lo, Gwo-Herng Ho, Mount-Learn Wu, Ching-Cherng Sun:
A study of large area die bonding materials and their corresponding mechanical and thermal properties. Microelectron. Reliab. 52(5): 872-877 (2012)

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