"Influence of underfill materials on the reliability of coreless flip chip ..."

Chun-Chih Chuang et al. (2008)

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DOI: 10.1016/J.MICROREL.2008.09.005

access: closed

type: Journal Article

metadata version: 2020-02-22

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Chun-Chih Chuang, Tsung-Fu Yang, Jin-Ye Juang, Yin-Po Hung, Chau-Jie Zhan, Yu-Min Lin, Ching-Tsung Lin, Pei-Chen Chang, Tao-Chih Chang:
Influence of underfill materials on the reliability of coreless flip chip package. Microelectron. Reliab. 48(11-12): 1875-1881 (2008)

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