"Growth competition between layer-type and porous-type Cu3Sn in ..."

David T. Chu et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.10.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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David T. Chu, Yi-Cheng Chu, Jie-An Lin, Yi-Ting Chen, Chun-Chieh Wang, Yen-Fang Song, Cheng-Cheng Chiang, Chih Chen, King-Ning Tu:
Growth competition between layer-type and porous-type Cu₃Sn in microbumps. Microelectron. Reliab. 79: 32-37 (2017)

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