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"Thermal expansion behavior of through-silicon-via structures in ..."

E. J. Cheng, Yu-Lin Shen (2012)

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DOI: 10.1016/J.MICROREL.2011.11.001

access: closed

type: Journal Article

metadata version: 2022-06-17

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E. J. Cheng, Yu-Lin Shen:
Thermal expansion behavior of through-silicon-via structures in three-dimensional microelectronic packaging. Microelectron. Reliab. 52(3): 534-540 (2012)

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