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"Effect of polyimide baking on bump resistance in flip-chip solder joints."
Hsi-Kuei Cheng et al. (2014)
- Hsi-Kuei Cheng, Shien-Ping Feng, Yi-Jen Lai, Kuo-Chio Liu, Ying-Lang Wang, Tzeng-Feng Liu, Chih-Ming Chen:
Effect of polyimide baking on bump resistance in flip-chip solder joints. Microelectron. Reliab. 54(3): 629-632 (2014)
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