"Investigation on copper diffusion depth in copper wire bonding."

Catherine H. Chen et al. (2011)

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DOI: 10.1016/J.MICROREL.2010.09.030

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type: Journal Article

metadata version: 2021-10-14

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Catherine H. Chen, Shawn X. Zhang, S. W. Ricky Lee, Lebbai Mohamed:
Investigation on copper diffusion depth in copper wire bonding. Microelectron. Reliab. 51(1): 166-170 (2011)

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