"Reliability of through-silicon-vias (TSVs) with benzocyclobutene liners."

Qianwen Chen et al. (2013)

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DOI: 10.1016/J.MICROREL.2012.12.012

access: closed

type: Journal Article

metadata version: 2020-02-22

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Qianwen Chen, Wuyang Yu, Cui Huang, Zhimin Tan, Zheyao Wang:
Reliability of through-silicon-vias (TSVs) with benzocyclobutene liners. Microelectron. Reliab. 53(5): 725-732 (2013)

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