"IMC growth reaction and its effects on solder joint thermal cycling ..."

Wen-Hwa Chen et al. (2013)

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DOI: 10.1016/J.MICROREL.2012.06.146

access: closed

type: Journal Article

metadata version: 2020-02-22

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Wen-Hwa Chen, Ching-Feng Yu, Hsien-Chie Cheng, Yu-min Tsai, Su-Tsai Lu:
IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging. Microelectron. Reliab. 53(1): 30-40 (2013)

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