"An investigation into the effects of probing and wire bonding stress on ..."

K. M. Chen et al. (2006)

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DOI: 10.1016/J.MICROREL.2005.02.016

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type: Journal Article

metadata version: 2020-02-22

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K. M. Chen, B. C. Wu, K. H. Tang, F. Y. Cheng, N. H. Kao, J. Y. Lai:
An investigation into the effects of probing and wire bonding stress on the reliability of BOAC. Microelectron. Reliab. 46(2-4): 335-342 (2006)

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