"Effect of pad surface finish and reflow cooling rate on the microstructure ..."

Sri Chaitra Chavali et al. (2013)

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DOI: 10.1016/J.MICROREL.2013.02.006

access: closed

type: Journal Article

metadata version: 2022-05-24

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Sri Chaitra Chavali, Yuvraj Singh, Ganesh Subbarayan, Anurag Bansal, Mudasir Ahmad:
Effect of pad surface finish and reflow cooling rate on the microstructure and the mechanical behavior of SnAgCu solder alloys. Microelectron. Reliab. 53(6): 892-898 (2013)

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