"Recent advances on kinetic analysis of electromigration enhanced ..."

Brook Huang-Lin Chao et al. (2009)

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DOI: 10.1016/J.MICROREL.2009.01.006

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type: Journal Article

metadata version: 2020-02-22

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Brook Huang-Lin Chao, Xuefeng Zhang, Seung-Hyun Chae, Paul S. Ho:
Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints. Microelectron. Reliab. 49(3): 253-263 (2009)

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