"Transient-induced latch-up test setup for wafer-level and package-level."

Detlef Bonfert et al. (2006)

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DOI: 10.1016/J.MICROREL.2006.08.002

access: closed

type: Journal Article

metadata version: 2020-02-22

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Detlef Bonfert, Horst A. Gieser, Heinrich Wolf, M. Frank, A. Konrad, J. Schulz:
Transient-induced latch-up test setup for wafer-level and package-level. Microelectron. Reliab. 46(9-11): 1629-1633 (2006)

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