"Effect of Cr additions on interfacial reaction between the Sn-Zn-Bi solder ..."

Jinglin Bi et al. (2011)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2010.09.028

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/BiHHLLM11
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/BiHHLLM11
Jinglin Bi, Anmin Hu, Jing Hu, Tingbi Luo, Ming Li, Dali Mao:
Effect of Cr additions on interfacial reaction between the Sn-Zn-Bi solder and Cu/electroplated Ni substrates. Microelectron. Reliab. 51(3): 636-641 (2011)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.