"Thermal characterization of planar high temperature power module packages ..."

David Berry et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.04.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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David Berry, Adrian Townsend, Weikun He, Hanguang Zheng, Khai D. T. Ngo, Guo-Quan Lu:
Thermal characterization of planar high temperature power module packages with sintered nanosilver interconnection. Microelectron. Reliab. 63: 104-110 (2016)

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