"Fine pitch copper wire bonding in high volume production."

Bernd K. Appelt et al. (2011)

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DOI: 10.1016/J.MICROREL.2010.06.006

access: closed

type: Journal Article

metadata version: 2020-02-22

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Bernd K. Appelt, Andy Tseng, Chun-Hsiung Chen, Yi-Shao Lai:
Fine pitch copper wire bonding in high volume production. Microelectron. Reliab. 51(1): 13-20 (2011)

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