"Reliability study of the electroless Ni-P layer against solder alloy."

M. O. Alam, Yan Cheong Chan, K. C. Hung (2002)

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DOI: 10.1016/S0026-2714(02)00068-9

access: closed

type: Journal Article

metadata version: 2022-07-20

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M. O. Alam, Yan Cheong Chan, K. C. Hung:
Reliability study of the electroless Ni-P layer against solder alloy. Microelectron. Reliab. 42(7): 1065-1073 (2002)

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