"Enhancing the reliability of CSP solder joints under thermal cycling ..."

Miao Zhu et al. (2024)

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DOI: 10.1016/J.MEJO.2024.106484

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type: Journal Article

metadata version: 2024-11-30

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Miao Zhu, Xuexia Yang, Yanxi Sun, Ze Wang, Erqiang Liu:
Enhancing the reliability of CSP solder joints under thermal cycling conditions through particle swarm optimization of an improved BP neural network. Microelectron. J. 154: 106484 (2024)

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