"Prospective development in diffusion barrier layers for copper ..."

H. Y. Wong, N. F. Mohd Shukor, Nowshad Amin (2007)

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DOI: 10.1016/J.MEJO.2007.04.011

access: closed

type: Journal Article

metadata version: 2020-02-22

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H. Y. Wong, N. F. Mohd Shukor, Nowshad Amin:
Prospective development in diffusion barrier layers for copper metallization in LSI. Microelectron. J. 38(6-7): 777-782 (2007)

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