"Enhancement of adhesion strength of Cu layer with low dielectric constant ..."

Grace Wang et al. (2005)

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DOI: 10.1016/J.MEJO.2004.11.010

access: closed

type: Journal Article

metadata version: 2020-02-22

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Grace Wang, S. Balakumar, S. C. Hwee, Rakesh Kumar, T. Hara:
Enhancement of adhesion strength of Cu layer with low dielectric constant SiC: H liners in Cu interconnects. Microelectron. J. 36(8): 749-753 (2005)

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