"3-D impedance matching network (IMN) based on through-silicon via (TSV) ..."

Xiao Shi et al. (2024)

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DOI: 10.1016/J.MEJO.2024.106467

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type: Journal Article

metadata version: 2024-11-30

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Xiao Shi, Tian Qiang, Mengye Cai, Yanfeng Jiang:
3-D impedance matching network (IMN) based on through-silicon via (TSV) for RF energy harvesting system. Microelectron. J. 154: 106467 (2024)

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