"Robustness enhancement through chip-package co-design for high-speed ..."

Meigen Shen et al. (2005)

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DOI: 10.1016/J.MEJO.2005.03.007

access: closed

type: Journal Article

metadata version: 2020-02-22

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Meigen Shen, Jian Liu, Li-Rong Zheng, Esa Tjukanoff, Hannu Tenhunen:
Robustness enhancement through chip-package co-design for high-speed electronics. Microelectron. J. 36(9): 846-855 (2005)

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