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"Through-silicon-via insertion for performance optimization in ..."
Libo Qian, Zhangming Zhu, Yintang Yang (2012)
- Libo Qian, Zhangming Zhu, Yintang Yang:
Through-silicon-via insertion for performance optimization in three-dimensional integrated circuits. Microelectron. J. 43(2): 128-133 (2012)
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