"Fine grain thermal modeling and experimental validation of 3D-ICs."

Herman Oprins et al. (2011)

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DOI: 10.1016/J.MEJO.2010.08.006

access: closed

type: Journal Article

metadata version: 2023-11-13

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Herman Oprins, Adi Srinivasan, Miroslav Cupák, Vladimir Cherman, Cristina Torregiani, Michele Stucchi, Geert Van der Plas, Paul Marchal, Bart Vandevelde, E. Cheng:
Fine grain thermal modeling and experimental validation of 3D-ICs. Microelectron. J. 42(4): 572-578 (2011)

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