"No-flow underfill: Effect of chip placement speed on the void formation ..."

Muhammad Naqib Nashrudin et al. (2021)

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DOI: 10.1016/J.MEJO.2021.105139

access: closed

type: Journal Article

metadata version: 2021-09-01

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Muhammad Naqib Nashrudin, Aizat Abas, M. Z. Abdullah, M. Yusuf Tura Ali, Z. Samsudin, Idris Mansor:
No-flow underfill: Effect of chip placement speed on the void formation using numerical method. Microelectron. J. 114: 105139 (2021)

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