"Experimental method and FE simulation model for evaluation of wafer ..."

D. S. Liu, M. K. Shih (2006)

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DOI: 10.1016/J.MEJO.2006.03.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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D. S. Liu, M. K. Shih:
Experimental method and FE simulation model for evaluation of wafer probing parameters. Microelectron. J. 37(9): 871-883 (2006)

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