"Miniaturized and high-performance RF packages with ultra-thin glass ..."

Min Suk Kim et al. (2018)

> Home

Details and statistics

DOI: 10.1016/J.MEJO.2018.05.002

access: closed

type: Journal Article

metadata version: 2024-10-06

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mj/KimPKPCSSKT18
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mj/KimPKPCSSKT18
Min Suk Kim, Markondeya Raj Pulugurtha, Youngwoo Kim, Gapyeol Park, Kyungjun Cho, Vanessa Smet, Venky Sundaram, Joungho Kim, Rao R. Tummala:
Miniaturized and high-performance RF packages with ultra-thin glass substrates. Microelectron. J. 77: 66-72 (2018)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.