"Electroless silver plating on through-glass via (TGV) as an adhesive and ..."

Yuxuan Huang et al. (2024)

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DOI: 10.1016/J.MEJO.2024.106371

access: closed

type: Journal Article

metadata version: 2024-09-20

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Yuxuan Huang, Zhihua Tao, Xudong Cai, Zhiyuan Long, Zewei Lin, Wenlei Li, Zhen Fang, Lingyue Wang, Siqi He, Xingzhou Cai, Yong Li, Jihua Zhang:
Electroless silver plating on through-glass via (TGV) as an adhesive and conducting layer. Microelectron. J. 152: 106371 (2024)

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