"Analysis of solder joint reliability of high power LEDs by transient ..."

Gordon Elger et al. (2015)

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DOI: 10.1016/J.MEJO.2015.08.007

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type: Journal Article

metadata version: 2020-02-22

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Gordon Elger, Shri Vishnu Kandaswamy, E. Liu, Alexander Hanss, Maximilian Schmid, Robert Derix, Fosca Conti:
Analysis of solder joint reliability of high power LEDs by transient thermal testing and transient finite element simulations. Microelectron. J. 46(12): 1230-1238 (2015)

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