"Process optimization for enhancing interconnect performance of large-size ..."

S. Cong et al. (2022)

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DOI: 10.1016/J.MEJO.2022.105383

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type: Journal Article

metadata version: 2022-03-16

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S. Cong, W. W. Zhang, P. Liu, Y. N. Han, Y. H. Tian:
Process optimization for enhancing interconnect performance of large-size BGA component during vibration loading. Microelectron. J. 121: 105383 (2022)

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