"Characterisation of electroplated Sn/Ag solder bumps."

Marc Bigas, Enric Cabruja (2006)

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DOI: 10.1016/J.MEJO.2005.05.017

access: closed

type: Journal Article

metadata version: 2022-09-01

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Marc Bigas, Enric Cabruja:
Characterisation of electroplated Sn/Ag solder bumps. Microelectron. J. 37(4): 308-316 (2006)

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