"Design and analysis of jitter-aware low-power and high-speed TSV link for ..."

Giulia Beanato et al. (2016)

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DOI: 10.1016/J.MEJO.2015.12.003

access: closed

type: Journal Article

metadata version: 2020-02-22

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Giulia Beanato, Kiarash Gharibdoust, Alessandro Cevrero, Giovanni De Micheli, Yusuf Leblebici:
Design and analysis of jitter-aware low-power and high-speed TSV link for 3D ICs. Microelectron. J. 48: 50-59 (2016)

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