"Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary ..."

Takafumi Fukushima et al. (2016)

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DOI: 10.3390/MI7100184

access: open

type: Journal Article

metadata version: 2021-10-14

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Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi:
Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration. Micromachines 7(10): 184 (2016)

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