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"Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by ..."

Simon J. Bleiker et al. (2016)

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DOI: 10.3390/MI7100192

access: open

type: Journal Article

metadata version: 2022-10-02

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  - journals/micromachines/BleikerTLVBN16
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  - https://dblp.org/rec/journals/micromachines/BleikerTLVBN16
Simon J. Bleiker, Maaike M. Visser Taklo, Nicolas Lietaer, Andreas Vogl, Thor Bakke, Frank Niklaus:
Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding. Micromachines 7(10): 192 (2016)

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