"Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by ..."

Simon J. Bleiker et al. (2016)

> Home

Details and statistics

DOI: 10.3390/MI7100192

access: open

type: Journal Article

metadata version: 2022-10-02

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/micromachines/BleikerTLVBN16
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/micromachines/BleikerTLVBN16
Simon J. Bleiker, Maaike M. Visser Taklo, Nicolas Lietaer, Andreas Vogl, Thor Bakke, Frank Niklaus:
Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding. Micromachines 7(10): 192 (2016)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.