"Special Issue on Interconnects for Chiplet Integration Technologies."

Debendra Das Sharma, Nam Sung Kim (2025)

> Home

Details and statistics

DOI: 10.1109/MM.2025.3534457

access: closed

type: Journal Article

metadata version: 2025-04-08

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/micro/SharmaK25
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/micro/SharmaK25
Debendra Das Sharma, Nam Sung Kim:
Special Issue on Interconnects for Chiplet Integration Technologies. IEEE Micro 45(1): 6-8 (2025)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.