"An Open Inter-Chiplet Communication Link: Bunch of Wires (BoW)."

Shahab Ardalan et al. (2021)

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DOI: 10.1109/MM.2020.3040410

access: closed

type: Journal Article

metadata version: 2021-02-04

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  - https://dblp.org/rec/journals/micro/ArdalanFKPSV21
Shahab Ardalan, Ramin Farjadrad, Mark Kuemerle, Ken Poulton, Suresh Subramaniam, Bapiraju Vinnakota:
An Open Inter-Chiplet Communication Link: Bunch of Wires (BoW). IEEE Micro 41(1): 54-60 (2021)

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