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"Low temperature Si/Si wafer direct bonding using a plasma activated method."
Dong-ling Li et al. (2013)
- Dong-ling Li, Zheng-guo Shang, Sheng-qiang Wang, Zhi-yu Wen:
Low temperature Si/Si wafer direct bonding using a plasma activated method. J. Zhejiang Univ. Sci. C 14(4): 244-251 (2013)
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