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"A Chip-PCB Hybrid SC PUF Used for Anti-Desoldering and Depackaging-Attack ..."

Meilin Wan et al. (2024)

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DOI: 10.1109/JSSC.2024.3352048

access: closed

type: Journal Article

metadata version: 2024-07-19

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Meilin Wan, Zhen Zhang, Yin Zhang, Zhangqing He, Haoshuang Gu, Kui Dai, Xuecheng Zou:
A Chip-PCB Hybrid SC PUF Used for Anti-Desoldering and Depackaging-Attack Protection. IEEE J. Solid State Circuits 59(7): 2330-2344 (2024)

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